“GDSI Provides outsourced engineering services to integrated device manufacturers and fabless semiconductor companies. GDSI ofers wafer backgrinding, polishing, dicing, die sort and inspection with quick turnaround times.”
KLA/Tencor Sigma Scan 1ea
KLA/Tencor Alpha Step 200 1ea
CTI On Board 8 Cryo pump 1ea
Advanced Energy MDX DC 5K Power supplies 2ea
CTI SCW Cryo Compressor 1ea
Granville Phillips 270 Gauge Controller 1ea
Granville Phillips 260 Gauge Controllers 2ea
Varian TSP Control Unit 1ea
It’s an exciting time to join UHV, one of the nations most innovative vacuum coating services. We’re ushering in a new era to help our customers meet the enormous challenges in the custom thin film coating industry. If you’re considering career opportunities with UHV, consider the following:
If being a part of our team seems like the right opportunity for you, please email your resume to [email protected], we will contact you for possible interview when a fitting position is available. Thank you for your consideration.
UHV Sputtering offers a high quality target bonding service as well as a wide range of sputtering materials. We specialize in bonding, employing state of the art Metalization Techniques. UHV utilize a variety of solder materials, which serve to interface the target and backing plate. These materials accommodate the various thermal and mechanical stresses that are characteristic in today’s sputtering equipment.
UHV custom tailors it’s bonds to meet each customers specific needs. For example, systems with high power density levels often require high temperature solder materials, while cathode designs with a severe mismatch in expansion rates achieve optimum performance with a more ductile material, such as indium.
Our materials consists of different sputtering target materials using the latest manufacturing methods, Hot Pressed, Sintured, Cold Isostatic Press, Hot Isostatic Press and sometimes a combination of these.
For more information, please contact our sales staff for more details or submit an RFQ.
UHV Sputtering offers a physical vapor deposition (PVD) method for custom thin film coatings, using DC and RF magnetron sputtering. We process up to 300mm diameter and custom sizes. Please fill out the quote form with your requirements and a sales representative will respond in a timely manner.
UHV Sputtering offers a wide inventory of sputtering target materials. Process capability includes DC and RF magnetron sputtering. We process up to 12″ diameter wafer as well as numerous other substrate materials. Our coatings are achieved under tight controls in a clean room environment, using completely refurbished, late model vacuum equipment.
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And many more….
UHV Sputtering offers a wide inventory of sputtering target materials. Process capability includes DC and RF magnetron sputtering. We process up to 300mm diameter wafers as well as numerous other substrate materials and custom sizes. Our coatings are achieved under tight controls in a class 100 clean room environment, using completely refurbished vacuum equipment.
Processing capabilities include PVD sputtering:
Annealing Capabilities
System Compatible Materials
Please contact us for all other materials and custom sizes.
Typical Specifications
Please contact us for all other capability information.
For more information, please contact our sales staff or submit an RFQ