Request A Quote For Bonding
Request A Quote For Bonding
Jan 11,2017
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By Mila Clement
UHV Sputtering offers a wide inventory of sputtering target materials. Process capability includes DC and RF magnetron sputtering. We process up to 12″ diameter wafer as well as numerous other substrate materials. Our coatings are achieved under tight controls in a clean room environment, using completely refurbished, late model vacuum equipment.
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