Sputtering Services
Sputtering Services
Jan 11,2017
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By Mila Clement
Some Industries we serve include:
And many more….
UHV Sputtering offers a wide inventory of sputtering target materials. Process capability includes DC and RF magnetron sputtering. We process up to 300mm diameter wafers as well as numerous other substrate materials and custom sizes. Our coatings are achieved under tight controls in a class 100 clean room environment, using completely refurbished vacuum equipment.
Processing capabilities include PVD sputtering:
- Dielectrics
- Resistors
- Conductive layers
- Insulators
- Noble films
- And many others, over 60 materials in stock
Annealing Capabilities
- In Atmosphere “Air”
- In N2 Environment
- Stabilize up to 450c
System Compatible Materials
- Substrates
- Alumina (Al2O3)
- Fused Silica
- Aluminum Nitride (AlN)
- Berillium Oxide (BeO)
- Vias
- Ferrite
- Graphite
- Si or Glass wafers (25mm – 300mm)
- Bare or with Thermal Oxide
- Pattern
- Photo Resist
- Polymers (high temp)
Please contact us for all other materials and custom sizes.
Typical Specifications
- Film thicknesses up to several microns on most materials.
- Film thickness are determined by mechanical surface profilometer
- Film uniformity: +/-5% (may vary per requested thickness and film)
- Resistance uniformity: +/- 10% window
- Target sheet resistance range from 20 Ω/sq – 150 Ω/sq
Please contact us for all other capability information.
For more information, please contact our sales staff or submit an RFQ